JPH0142349Y2 - - Google Patents
Info
- Publication number
- JPH0142349Y2 JPH0142349Y2 JP1983191826U JP19182683U JPH0142349Y2 JP H0142349 Y2 JPH0142349 Y2 JP H0142349Y2 JP 1983191826 U JP1983191826 U JP 1983191826U JP 19182683 U JP19182683 U JP 19182683U JP H0142349 Y2 JPH0142349 Y2 JP H0142349Y2
- Authority
- JP
- Japan
- Prior art keywords
- chamfer
- diameter
- wire
- ball
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983191826U JPS6099537U (ja) | 1983-12-13 | 1983-12-13 | ワイヤボンダ用ツ−ル |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983191826U JPS6099537U (ja) | 1983-12-13 | 1983-12-13 | ワイヤボンダ用ツ−ル |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6099537U JPS6099537U (ja) | 1985-07-06 |
JPH0142349Y2 true JPH0142349Y2 (en]) | 1989-12-12 |
Family
ID=30412988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983191826U Granted JPS6099537U (ja) | 1983-12-13 | 1983-12-13 | ワイヤボンダ用ツ−ル |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6099537U (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999033100A1 (fr) * | 1997-12-19 | 1999-07-01 | Toto Ltd. | Capillaire de microcablage |
-
1983
- 1983-12-13 JP JP1983191826U patent/JPS6099537U/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999033100A1 (fr) * | 1997-12-19 | 1999-07-01 | Toto Ltd. | Capillaire de microcablage |
Also Published As
Publication number | Publication date |
---|---|
JPS6099537U (ja) | 1985-07-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI358096B (en]) | ||
US4974767A (en) | Double cone wire bonding capillary | |
JPH03780B2 (en]) | ||
JP3333399B2 (ja) | ワイヤボンディング装置用キャピラリ | |
JPH0142349Y2 (en]) | ||
JP3347598B2 (ja) | ワイヤボンディング装置用キャピラリ | |
JP3128718B2 (ja) | ワイヤボンデイング方法 | |
JP3455126B2 (ja) | ワイヤボンデイング方法 | |
JPS6052585B2 (ja) | ワイヤボンディング法 | |
JPH0219967Y2 (en]) | ||
JP3702929B2 (ja) | ワイヤボンディング方法 | |
JPH05267385A (ja) | ワイヤーボンディング装置 | |
JPS6042614B2 (ja) | 半導体装置のボンデイング方法 | |
US6278191B1 (en) | Bond pad sealing using wire bonding | |
JP2914337B2 (ja) | ワイヤボンディング装置 | |
JP3233194B2 (ja) | ワイヤボンディング方法 | |
JP2788885B2 (ja) | 半導体装置用リードフレームおよび半導体装置 | |
JPS5923419Y2 (ja) | ワイヤボンデイング用キヤピラリ− | |
JPH0428241A (ja) | 半導体装置の製造方法 | |
JPH1174300A (ja) | バンプ形成方法およびそれを用いた半導体装置の製造方法 | |
JP2000357700A (ja) | ボールボンディング方法および電子部品の接続方法 | |
JPH0779118B2 (ja) | ワイヤーボンディング装置 | |
JPH04123434A (ja) | バンプ形成方法 | |
JP2001338941A (ja) | バンプ形成装置及びバンプ形成方法 | |
JPS60242629A (ja) | ワイヤボンデイング装置 |